Uncooled 640x512 12μm Thermal Imaging Module Light Weight
Product Overview
The COIN612G2 uncooled infrared imaging core features a 640×512 12μm ApexCore wafer-level infrared detector paired with premium signal processing circuits and optimized imaging algorithms. It delivers exceptional thermal sensitivity with typical NETD ≤25mK and supports multiple communication protocols including USB 2.0, DVP, LVDS, and BT.656 video outputs.
Main Features
- Comprehensive Functionality: High-performance, cost-efficient ApexCore wafer-level infrared detector with NETD ≤25mK
- Compact Design: Dimensions: 25.4×25.4×15.7mm, Weight: 15±1g, Power consumption ≤0.65W
- Versatile Configuration: Multiple lens options and supports USB 2.0/DVP/LVDS/BT.656 image output interfaces
- Rapid Integration: Outputs RAW/YUV image data with serial port control
Product Specifications
| Model |
COIN612G2 |
| IR Detectors Indicators |
|
| Sensitive Material |
VOx |
| Resolution |
640×512 |
| Pixel Size |
12μm |
| Spectral Response |
8μm ~ 14μm |
| Typical NETD |
≤25mK/F1.0/25℃ |
| Image Processing |
|
| Digital Frame Rate |
25/30/50Hz |
| Start-up Time |
6s |
| Analog Video |
PAL/NTSC |
| Digital Video |
RAW/YUV422 |
| Image Algorithm |
Non-uniformity Correction (NUC), 3D Noise Reduction (3DNR), 2D Noise Suppression (DNS), Dynamic Range Compression (DRC), Edge Enhancement (EE) |
| Image Display |
10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| PC Software |
ICC Software - Module Control & Video Display |
| Electrical |
|
| Standard External Interface |
50pin: DF40C-50DP-0.4V(51), (HRS,Male) |
| Extension Board |
USB3.0/USB2.0/VPC/USB2.0&VPC |
| Communication Interface |
TTL-232/USB2.0 |
| Digital Video Interface |
DVP8/DVP16/USB2.0/BT.656/LVDS |
| Supply Voltage |
4.5~5.5V |
| Typical Power Consumption |
0.65W |
| Mechanical |
|
| Bare Core Size(mm) |
25.4×25.4×15.7 |
| Bare Core Weight(g) |
15±1g |
| Environmental Adaptability |
|
| Operating Temperature |
-40℃~+70℃ |
| Storage Temperature |
-45℃~+85℃ |
| Humidity |
5%~95%, non-condensing |
| Vibration |
5.35grms, Random Vibration, 3-axis |
| Impact |
Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times |
| Certification |
ROHS2.0/REACH |
| Optical Lens |
|
| Optical Lens |
Fixed Focus Athermal: 4.8mm/7mm/9.1mm/13mm/19mm/25mm/35mm/50mm/70mm |
| Protection Level |
IP67(Front Lens) |
Industrial Applications
- Security Monitoring
- Industrial Vision
- Outdoor Observation
- Firefighting & Rescue
- ADAS
- Machine Vision
About SensorMicro
SensorMicro was founded with a simple but powerful belief: Innovation should serve real-world needs. We exist to empower people and systems to see beyond the surface—into the patterns, problems, and possibilities that lie beneath.
By turning invisible heat into visible truth, we help industries make smarter decisions, protect what matters most, and navigate complexity with clarity. Our business spans security, firefighting, industrial inspection, medical care, machine vision, environmental monitoring, and carbon neutrality initiatives.
Frequently Asked Questions
What is the advantage of infrared thermal imaging?
- See through total darkness
- Identification under camouflage
- Long range detection
- Heat distribution detection
- Non-contact temperature measurement
- Occupation awareness
What is thermal sensitivity?
Thermal Sensitivity, also named NETD (Noise Equivalent Temperature Difference), is a key parameter for evaluating medium wave (MWIR) and long wave (LWIR) thermal imaging cameras. It is directly related to the clarity measured by the thermal imager. It is a numerical value representing the signal-to-noise ratio of the temperature difference and measured in milliKelvins (mK). The smaller the thermal sensitivity value, the higher the sensitivity and the clearer the image.
What is the difference between wafer level package, ceramic package and metal package?
Uncooled infrared detectors are currently divided into metal packaging, ceramic packaging, and wafer-level packaging. Metal packaging is the earliest and the best among the three main packaging forms; wafer-level packaging is suitable for mass production; and the ceramic packaging is more favored by the dedicated market for civilian products.
